| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition allowing stable manufacture of an electronic device while having excellent low-temperature curing property.SOLUTION: The photosensitive resin composition comprises an alkali-soluble resin (A) and a crosslinking agent (B). When the composition is dissolved in an organic solvent (C) to have a solid content of 50 mass%, the obtained varnish-like photosensitive resin composition has a thickening percentage x of 55% or less, calculated by 100×(η-η)/η, where ηrepresents a viscosity of the varnish-like photosensitive resin composition after stored in a nitrogen atmosphere at 60°C for 24 hours and ηrepresents a viscosity of the composition before the storage. When a resin film (a) is obtained by drying the above varnish-like photosensitive resin composition under the conditions of 80°C for 90 seconds to remove the organic solvent (C) and then the resin film (a) is heat treated in a nitrogen atmosphere under the conditions of 220°C for 90 minutes, the obtained resin film (b) has a glass transition temperature of 150°C or higher.SELECTED DRAWING: None |
