| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a process for mounting an electronic component in which the occurrence of an incomplete connection can be prevented by checking the presence of a foreign matter at an electronic component mounting position. <P>SOLUTION: The process for mounting an electronic component 4 on a printed wiring board 9 using a camera 1 and a component handling mechanism 5 includes a step for detecting the position of the printed wiring board 9 by detecting a mark 11 put on the printed wiring board 9 by means of the camera 1, a step for judging a prestored mounting position of the electronic component 4 on the printed wiring board 9 from a detected position, and a step for photographing the mounting position by means of the camera 1 and mounting the electronic component 4 at the mounting position after judging that no foreign matter is present at the mounting position. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
