| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for packaging a semiconductor element, which improves the bonding strength of a bump electrode by an ultrasonic bonding, and to provide a manufacturing method therefor and a semiconductor device. SOLUTION: The substrate 19 for packaging semiconductor elements has a packaging section 11, where electrode pads 12 are formed for packaging a semiconductor element 21 having the bump electrode 23 on a plurality of electrode terminals 22 formed on the lower surface thereof, on the upper surface of an insulating substrate 11. The bump electrode 23 is brought into contact with the electrode pad 12, and ultrasonic waves are applied from the upper surface of the semiconductor element 21 for joining the bump electrode 23 to the electrode pad 12. In the electrode pad 12, a center part 12a in the region brought into contact with the bump electrode 23 is lower than the peripheral part 12b, and an annular gap 12c is provided between the center part 12a and the peripheral part 12b. The center part 12a and the peripheral part 12b of the electrode pad 12 are engaged with the bump electrode 23, and a stress at joining can be relaxed by the gap 12c, thus joining strength and packaging reliability can be improved. COPYRIGHT: (C)2008,JPO&INPIT |
