| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent increase of manufacturing cost while a reflection factor is improved on light of a substrate-side. <P>SOLUTION: A light emitting device is provided with wiring parts 22 and 23 formed on a substrate 2 by a prescribed pattern, a solder resist 21 coating the wiring parts 22 and 23 and having the reflection factor higher than the wiring parts 22 and 23, and an LED chip 3 which is loaded on the solder resist 21 on the wiring part 22 and is electrically connected to the wiring parts 22 and 23 by wire 4. The solder resist 21 has an opening 21a where the wiring parts 25 and 26 are exposed with wire 4 in the wiring parts 22 and 23. <P>COPYRIGHT: (C)2008,JPO&INPIT |
