发明名称 SUBSTRATE CUTTING METHOD AND DISPLAY MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate cutting method and a display manufacturing method.SOLUTION: A substrate cutting method includes a step which forms a first protection layer on a first surface of a substrate, a step which forms a removing area where an area of the first protection layer is removed by irradiating a first laser beam toward the first protection layer, and a step which removes the area of the substrate by irradiating a second laser beam toward the removing area at least so as to correspond to the removing area, to form a cutting area.SELECTED DRAWING: Figure 6
申请公布号 JP2016203257(A) 申请公布日期 2016.12.08
申请号 JP20160058659 申请日期 2016.03.23
申请人 SAMSUNG DISPLAY CO LTD 发明人 YOU JUNGHWA;KIM TAE YONG;KIM HYO-JIN;JEONG ILYOUNG;HAN GYOO-WAN;RYU JE-KIL;LI JAN-HAO
分类号 B23K26/38;B23K26/064;B28D1/22;C03B33/09 主分类号 B23K26/38
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