发明名称 JOINTING DEVICE OF FLEXIBLE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a jointing device of a flexible substrate, capable of reducing volume by suppressing thickness of a jointing part of a flexible substrate while improving peeling resistance of the flexible substrate. SOLUTION: A bending part 11 is formed on a flexible substrate 10. The flexible substrate 10 is bent at the bending part 11, and the portions separated by bending are jointed to two surfaces, the upper surface and side surface of a printed board 20. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008091797(A) 申请公布日期 2008.04.17
申请号 JP20060273361 申请日期 2006.10.04
申请人 OLYMPUS CORP 发明人 TANAKA YOSHINORI
分类号 H05K1/14;H05K1/02 主分类号 H05K1/14
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