LED ELEMENT SUBSTRATE, LED-MOUNTED MODULE AND LED DISPLAY DEVICE USING THESE

摘要

The purpose of the present invention is to provide an LED-mounted module which can be optimally used as a backlight in large LED display devices and which can improve heat dissipation and productivity of LED display devices, etc. This LED element substrate 1 is provided with a resin substrate 11 comprising a flexible resin film and a metal wiring unit 13 which is laminated on the resin substrate 11 for conducting between electrodes of LEDs elements 2 and on which an insulation unit is formed. The thermal conductivity λ of the metal configuring the metal wiring unit 13 is 300-500 W/(m*K), the electrical resistivity R of the metal configuring the metal wiring unit 13 is 2.50×10-8 Ωm or less, and the metal wiring unit 13 covers 95% or more of one surface of the resin substrates 11.