| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit unstable operation and which is suitable for downsizing.SOLUTION: A semiconductor device including a package comprises: an input terminal 10 fixed to the package; an input pre-match substrate P1 provided in the package; a semiconductor element T1 which is provided in the package and formed on a substrate different from the input pre-match substrate; a circuit element 20 formed on the input pre-match substrate; a matching circuit composed of first wires W11-14 for connecting the input terminal and the circuit element and second wires W21-24 for connecting the circuit element and the semiconductor element; and a stabilization circuit composed of a first MIM (Metal Insulator Metal) capacitor C21 formed as part of the circuit element, a first resistance R11 for inhibiting oscillation and a second MIM capacitor C11. A bottom electrode 32 of the first MIM capacitor is connected to the package by a via G1 provided in the input pre-match substrate.SELECTED DRAWING: Figure 3 |
