| 摘要 |
PROBLEM TO BE SOLVED: To stabilize formation of a molten ball by a FAB of bonding wire.SOLUTION: In a palladium-coated copper wire for ball bonding having a wire size of 10-25 μm, where a coating film of palladium(Pd) is formed on a core material composed of copper (Cu) or a copper alloy, a solid layer of palladium alone exists in the coating layer of palladium, and an exudation layer of copper from the core material is formed on the coating layer of palladium. Furthermore, in a palladium-coated copper wire for ball bonding having a wire size of 10-25 μm, where a coating film of gold(Au) is formed on a core material composed of copper or a copper alloy, an exudation layer of copper is formed on the skin layer of gold, and a solid layer of palladium alone exists in the coating layer of palladium.SELECTED DRAWING: Figure 1 |
