| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device that can rectify jet solder while reducing the cost.SOLUTION: A soldering device includes a soldering nozzle 120 for making molten solder S in a solder bath pass through an internal flow passage T as an area inside a nozzle wall 121 formed in the soldering device to jet the solder, and a mask plate 200 on which a printed wiring board 10 having plural electronic components mounted thereon is mounted is configured so that in the mask plate 200 is formed an opening portion 201 opening in the thickness direction thereof, and a plate wall portion 202 is formed which is formed at a portion adjacent to the opening portion 201 so as to extend in the thickness direction, and the molten solder S passes through the internal flow passage T, and flows into a rectifying area U as an area formed between the nozzle wall 121 and the plate wall portion 202 under a state that the soldering nozzle 120 is inserted in the opening portion 201.SELECTED DRAWING: Figure 3 |
