POLYIMIDE RESIN, RESIN COMPOSITION USING SAME, AND LAMINATED FILM

摘要

Provided are a polyimide resin having high heat resistance which is free of voids even in a large area and is capable of uniform temporary adhesion, and a resin composition and a laminated film using the same. The present invention is a polyimide resin having at least an acid anhydride residue and a diamine residue, the polyimide resin including at least 60 mol% of a polysiloxane-based diamine residue in the total amount of diamine residue.