发明名称 RESIST PEELING METHOD AND PEELING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a resist peeling method and a resist peeling device for accelerating the resist peeling speed.SOLUTION: In a method for supplying a mixture gas A, containing a hydrogen source into a space 2h while arranging a silicon substrate S, on which resist R is formed, in the space 2h where the pressure is maintained at a predetermined level or less, and bringing the mixture gas A into contact with a heated catalyst 10 placed in the space 2h, the mixture gas A contains oxygen. since the mixture gas A contains oxygen, when it is brought into contact with the catalyst 10, a hydroxyl radical can be generated together with the hydrogen radical. Consequently, the peeling speed can be accelerated by the synergetic effect of hydrogen radical and hydroxyl radical, compared with a case of only hydrogen radical.SELECTED DRAWING: Figure 1
申请公布号 JP2016213328(A) 申请公布日期 2016.12.15
申请号 JP20150095977 申请日期 2015.05.08
申请人 OSAKA CITY UNIV 发明人 HORIBE HIDEO;YAMAMOTO MASAFUMI;SHIKAMA KYOICHI
分类号 H01L21/027;H01L21/304;H01L21/677 主分类号 H01L21/027
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