| 摘要 |
A bonding apparatus (10) comprises a vacuum grid (19) for holding a glass substrate (12), a curved pad (20) opposed to the glass substrate (12) and used for holding an bond member (16) composed of a wafer (13) and an adhesive tape (15), and moving means (22) for bringing the curved pad (20) toward the vacuum grid (19). The curved pat (20) has a curved face region (46) the distance of which from a flat face region (39) of the vacuum grid (19) is gradually increased outward from a central portion (C). As the vacuum grid (19) and the curved pad (20) are brought close to each other in a substantially vacuum chamber by the moving means (22), the glass substrate (12) and the bond member (16) are gradually bonded to each other while releasing a small quantity of air, if any inbetween, to the outside. |
