TRANSPARENT RESIN COMPOSITION, ADHESIVE COMPRISING COMPOSITION, DIE BOND MATERIAL COMPRISING COMPOSITION, CONDUCTIVE CONNECTION METHOD USING COMPOSITION, AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED USING METHOD

摘要

The present invention pertains to a transparent resin composition containing: (A) a silicone composition containing (A-1) 100 parts by mass of an organopolysiloxane having at least one structure represented by general formula (1) per molecule, and (A-2) 0.1-10 parts by mass of an organic peroxide, relative to 100 parts by mass of the total (A-1) component content; and (B) conductive particles having an average particle diameter of 1μm or less. Therein, the (B) component content is greater than 0 vol% and less than 0.1 vol% relative to the solid content of the (A) component, the total light transmittance of a cured article obtained by curing the transparent resin composition and having a thickness of 2mm is 70% or higher, and the haze value thereof is 60% or lower. As a result, the provided transparent resin composition achieves a cured article having high transparency, exhibiting excellent adhesive strength and workability, and having heat resistance and light resistance.