Electronic Device with Redistribution Layer and Stiffeners and Related Methods

摘要

A method includes forming a molded panel that includes a number of integrated circuits, fan-out components and stiffeners embedded in an encapsulation material. A redistribution layer is formed over the integrated circuits and the fan-out components. The redistribution layer is electrically coupled to contacts of the integrated circuits. The molded panel is singulated to form electronic devices. Each electronic device each an integrated circuit that is separated from a fan-out component by a portion of the encapsulation material and a stiffener separated from the fan-out component by a second portion of the encapsulation material.

主权项

1. A method of making an electronic device, the method comprising:
providing an integrated circuit having a plurality of electrically conductive connectors coupled to a first surface of the integrated circuit; forming an encapsulation material surrounding the integrated circuit and the plurality of electrically conductive connectors; positioning a fan-out component adjacent the integrated circuit and separated therefrom by a portion of the encapsulation material; positioning a stiffener adjacent the fan-out component and separated therefrom by a second portion of the encapsulation material; electrically connecting a redistribution layer to the plurality of electrically conductive connectors; and positioning a heat sink layer adjacent a second surface of the integrated circuit, the second surface opposite the first surface.