| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer board for mounting semiconductor chips in which internal stresses caused by the difference in thermal expansion coefficients between sealing resin composed of a thermosetting resin and circuit elements composed of silicon and generated inside the circuit device at high temperature are suppressed, and a semiconductor-chip mounted multilayer board. <P>SOLUTION: An interlayer insulating film 11 is formed with a thermosetting resin between each conductive wiring layer 12, forming a multilayer structure. Thereby, the interlayer insulating film 11 functions as a thermal-stress buffering layer, and prevents lowering of the device reliability caused by the internal stresses. In addition, by using a liquid-crystal polymer for the thermosetting resin used herein, it is possible to prevent invasion of moisture into the device. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
