发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To inhibit generation of oxygen vacancies in an oxide semiconductor film in a semiconductor device including an oxide semiconductor; and to improve electrical characteristics in a semiconductor device including an oxide semiconductor.SOLUTION: A method for manufacturing a semiconductor device including an oxide semiconductor includes the steps of forming an oxide semiconductor film, a gate insulating film provided over the oxide semiconductor film, a gate electrode in contact with the gate insulating film, a sidewall insulating film in contact with the gate electrode, and a source electrode and a drain electrode in contact with the oxide semiconductor film. In the method, the gate insulating film and the sidewall insulating film are formed at a temperature at which oxygen contained in the oxide semiconductor film is inhibited from being eliminated, preferably at a temperature lower than a temperature at which oxygen contained in the oxide semiconductor film is eliminated. |
申请公布号 |
JP2013219336(A) |
申请公布日期 |
2013.10.24 |
申请号 |
JP20130044636 |
申请日期 |
2013.03.06 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
OKAZAKI KENICHI;YASUMOTO SEIJI;SHINJO SHUN;YAMAZAKI SHUNPEI |
分类号 |
H01L21/336;H01L21/316;H01L21/318;H01L21/8234;H01L21/8242;H01L21/8244;H01L21/8247;H01L27/08;H01L27/088;H01L27/108;H01L27/11;H01L27/115;H01L29/786;H01L29/788;H01L29/792 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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