发明名称 |
POLISHING PAD FOR ELECTROCHEMICAL-MECHANICAL POLISHING |
摘要 |
The invention provides a polishing pad comprising a body having a top surface (10) comprising a first set of grooves (12) with a first depth and first width and a bottom surface comprising a second set of grooves (16) with a second depth and second width, wherein the first set of grooves (12) and second set of grooves (16) are interconnected and are oriented such that they are not aligned.
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申请公布号 |
KR20060026437(A) |
申请公布日期 |
2006.03.23 |
申请号 |
KR20057024555 |
申请日期 |
2005.12.22 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
SEVILLA ROLLAND K. |
分类号 |
B23H5/08;B24B37/04;B24D11/00;B24D13/14 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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