发明名称 POLISHING PAD FOR ELECTROCHEMICAL-MECHANICAL POLISHING
摘要 The invention provides a polishing pad comprising a body having a top surface (10) comprising a first set of grooves (12) with a first depth and first width and a bottom surface comprising a second set of grooves (16) with a second depth and second width, wherein the first set of grooves (12) and second set of grooves (16) are interconnected and are oriented such that they are not aligned.
申请公布号 KR20060026437(A) 申请公布日期 2006.03.23
申请号 KR20057024555 申请日期 2005.12.22
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 SEVILLA ROLLAND K.
分类号 B23H5/08;B24B37/04;B24D11/00;B24D13/14 主分类号 B23H5/08
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