发明名称 AUTOMATIC MOUNTING APPARATUS FOR ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an automatic mounting apparatus for electronic components, capable of surely mounting the electronic components even if heights of mounting positions of the electronic components are not constant such as the case that the electronic component is mounted on the upper surface of an electronic component already mounted on a printed board. <P>SOLUTION: In a step of mounting an electronic component on the upper surface of the other electronic component already mounted on a printed board, the position and the height of mounting the electronic component in mounting data for the step stored in a RAM 31 are different from those in other steps. In this case, if height data of the upper surface of the electronic component already mounted on the printed board are inputted in H data, a stroke motor 115 is controlled by a CPU 30 according to the height directed by the H data in such a way that a suction nozzle is moved downward to the height directed by the H data by each step. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006229244(A) 申请公布日期 2006.08.31
申请号 JP20060107152 申请日期 2006.04.10
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 OYAMA KAZUYOSHI
分类号 H05K13/04 主分类号 H05K13/04
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