MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD INCORPORATING THIN FILM CAPACITOR HAVING DIELECTRIC THIN FILM USING LASER LIFT-OFF, AND PRINTED CIRCUIT BOARD INCORPORATING ITS THIN FILM CAPACITOR MANUFACTURED BY THIS METHOD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed circuit board incorporating a capacitor having a dielectric thin film using a laser lift-off and a capacitor manufactured by this method.

SOLUTION: There are provided a manufacturing method of the present invention incorporating a thin film capacitor, including: forming a dielectric thin film 13 on a transparent substrate 11 and then applying heat treatment thereto; forming a conductive layer 15 on the dielectric thin film thus subjected to the heat treatment; irradiating a lower part of the transparent substrate of a lamination formed as described above with laser beams, thereby separating the transparent substrate from this lamination; forming a conductive layer 17 having a prescribed pattern on the dielectric thin film from which the transparent substrate is separated; and forming an insulating layer and the conductive layer alternately by desired number of times on the conductive layer in upper/lower parts of the formed thin film, and a printed circuit board incorporating the thin film capacitor manufactured by this method.

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