| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a wiring layer on an insulating layer in a simple process, using aerosol deposition method. SOLUTION: The manufacturing method of the wiring board includes: a first step of forming a first insulating member on a metal layer; a second step of forming a first opening at the first insulating member for exposing the metal layer; a third step of forming a second insulating member, having a second opening which exposes the metal layer and part of the first insulating member, on the first insulating member; a fourth step of jetting metal particles which serve as a wiring layer, onto the metal layer at a first speed which is not lower than the critical speed, with respect to the metal layer and which is not higher than the critical speed with respect to the first insulating layer, jetting further the metal particles which will serve as the wiring layer, onto the first insulating member, at a second speed which is not lower than the critical speed, with respect to the metal layer and the first insulating layer and not higher than the critical speed, with respect to the second insulating layer, and forming the wiring layer by an aerosol deposition method; and a fifth step of removing the second insulating layer. COPYRIGHT: (C)2010,JPO&INPIT |
