发明名称 CONDUCTIVE POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition made to have sufficient high molecular weight, wide in moldable temperature width estimated from the difference between melting point and thermal decomposition temperature, superior in melting moldability, also superior in conductibility, while being low in water absorbability; furthermore, superior in chemical resistance, hydrolysis properties and the like, compared with conventional aliphatic polyamide resins. SOLUTION: In the polyamide resin composition, a polyamide resin, of which the dicarboxylic acid component includes oxalic acid and the diamine component is composed of 1,9-nonanediamine and 2-methyl-1,8-octanediamine with the molar ratio between 1,9-nonanediamine and 2-methyl-1,8-octanediamine being from 1:99 to 99:1, contains a conductivity-imparting agent. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010018794(A) 申请公布日期 2010.01.28
申请号 JP20090138618 申请日期 2009.06.09
申请人 UBE IND LTD 发明人 MAEDA SHUICHI;KURACHI KOICHIRO;SHIMOKAWA MASAHITO;NAKAGAWA TOMOYUKI;OKUSHITA YOJI;FUJIMURA HIDEKI
分类号 C08L77/06;C08G69/26;C08K3/04;C08K7/06 主分类号 C08L77/06
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