发明名称 PHOTOCURABLE COMPOSITION AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a photocurable composition capable of increasing the adhesiveness of a cured article film to an application target member, increasing the light reflectance of the cured article film because of its while color and increasing the heat resistance of the cured article film.SOLUTION: The photocurable composition is applied partially and in a plurality of locations on the surface of an application target member and contains epoxy (meth)acrylate having no carboxyl group and having a weight average molecular weight of 2000 or more, a photocurable compound which is not the epoxy (meth)acrylate having a weight average molecular weight of 2000 or more, does not have a weight average molecule weight of 2000 or more and has one ethylenic unsaturated bond, a titanium oxide, and a photoinitiator, and the content of the epoxy (meth)acrylate is 5 wt.% to 30 wt.% inclusive.SELECTED DRAWING: Figure 1
申请公布号 JP2016204629(A) 申请公布日期 2016.12.08
申请号 JP20160025777 申请日期 2016.02.15
申请人 SEKISUI CHEM CO LTD 发明人 KIN CHIZURU
分类号 C08F290/06;C08F2/50;C08G75/04;C09D7/12;C09D163/10;C09D201/00;H05K3/28 主分类号 C08F290/06
代理机构 代理人
主权项
地址