| 摘要 |
PROBLEM TO BE SOLVED: To reduce variations in forward voltage VF of a temperature-sensitive diode that occur for each semiconductor chip. SOLUTION: The semiconductor apparatus is provided with a plurality of resistors 31-34 and a wiring 35 respectively connected with each other while being branched from the temperature-sensitive diode 20, pads 41-45 provided respectively corresponding to a plurality of the resistors 31-34 and the wiring 35, and a pad 10 provided to the side opposite to a plurality of the resistors 31-34 and the wiring 35 in the temperature-sensitive diode 20. A plurality of paths are composed including the temperature-sensitive diodes 20 between the pad 10 and the pads 41-45. Any one of a plurality of the resistors 31-34 or the wiring 35 is selected so that a temperature between the pad 10 and the pads 41-45 is within a desired range. The path including the selected resistor or the wiring is used. COPYRIGHT: (C)2007,JPO&INPIT |
