发明名称 |
Stacked half-bridge package with a common conductive leadframe |
摘要 |
According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input, a control source coupled to an output terminal, and a control gate for being driven by a driver IC. The stacked half-bridge package further includes a sync transistor having a sync drain for connection to the output terminal, a sync source coupled to a low voltage input, and a sync gate for being driven by the driver IC. The control and sync transistors are stacked on opposite sides of a common conductive leadframe with the common conductive leadframe electrically and mechanically coupling the control source with the sync drain. The common conductive leadframe thereby serves as the output terminal. |
申请公布号 |
EP2477221(B1) |
申请公布日期 |
2016.06.22 |
申请号 |
EP20110191634 |
申请日期 |
2011.12.01 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
CHO, EUNG SAN;CHEAH, CHUAN;SAWLE, ANDREW N. |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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