| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package structure capable of preventing a deterioration in a device characteristic. <P>SOLUTION: The semiconductor device related to this invention comprises a circuit board 1, a first semiconductor chip 10 mounted on the circuit board 1, a second semiconductor chip 20 mounted on the first semiconductor chip 10, and a sealing resin 50 for sealing the first semiconductor chip 10 and the second semiconductor chip 20. A circuit surface 11 of the first semiconductor chip 10 is positioned on the side opposite to the side of the circuit board 1. The semiconductor device further comprises a fillet 30 for covering the side surface 22 for overlapping the circuit surface 11 of the first semiconductor chip 10 out of the side surface of the second semiconductor chip 20. <P>COPYRIGHT: (C)2008,JPO&INPIT |
