发明名称 COOLING APPARATUS
摘要 This invention relates to a cooling apparatus comprising a first cooling element (5) with first channels (6) extending between a first manifold (1) and a second manifold (2) and with a base plate (9) with a first surface (10) for receiving a heat load from an electric component (11), and a second cooling element (14) with second channels (16) extending between a third manifold (3) and a fourth manifold (4). A first section (21) of the second cooling element (14) is provided with openings (19) for allowing an airflow (18) to pass through the first section (21). The second cooling element (14) comprises a second section (22) provided with openings (19), and the cooling apparatus is configured to conduct the airflow (18) which has passed through the first section (21) through the openings (19) of the second section (22).
申请公布号 US2016201993(A1) 申请公布日期 2016.07.14
申请号 US201614988225 申请日期 2016.01.05
申请人 ABB Technology Oy 发明人 Rumpunen Anna;Agostini Bruno;Habert Mathieu;Jauhonen Roman;Koivuluoma Timo
分类号 F28D15/02;F28F13/06 主分类号 F28D15/02
代理机构 代理人
主权项 1. A cooling apparatus comprising: a first cooling element with first channels extending between a first manifold and a second manifold and with a base plate with a first surface for receiving a heat load from an electric component and for passing said heat load into a fluid in the first channels, and a second cooling element with second channels extending between a third manifold and a fourth manifold, the third manifold of the second cooling element is arranged to receive fluid from the second manifold of the first cooling element and to pass the received fluid via the second channels to the fourth manifold, a first section of the second cooling element is provided with openings for allowing an airflow to pass through the first section, the second cooling element comprising a second section provided with openings, and the cooling apparatus is configured to conduct the airflow which has passed through the first section through the openings of the second section.
地址 Helsinki FI