发明名称 ENCAPSULATED ELECTRICAL DEVICE AND METHOD OF FABRICATION
摘要 A device (100) may include an electrical assembly (102) having at least one electrical component; an inner shell (108) comprising a first polymeric material conformally disposed around the electrical component, the inner shell (108) comprising a first mechanical strength; and an outer shell (110) comprising a second polymeric material conformally disposed around the inner shell (108), the outer shell (110) comprising a second mechanical strength greater than the first mechanical strength, wherein the electrical component comprises a first coefficient of thermal expansion (CTE), the inner shell (108) comprises a second CTE, and the outer shell (110) comprises a third CTE, and wherein a difference between the first CTE and second CTE is less than a difference between the first CTE and third CTE.
申请公布号 WO2016161617(A1) 申请公布日期 2016.10.13
申请号 WO2015CN76260 申请日期 2015.04.10
申请人 HAMLIN ELECTRONICS SUZHOU CO. LTD 发明人 LV, Haitao;CHU, Guiting;PAN, Shangchun
分类号 G01D11/24 主分类号 G01D11/24
代理机构 代理人
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