| 摘要 |
<p>An array of integrated circuits (102), each incorporating a radiation sensing means is provided on a silicon wafer (101). A regular array of lenses, each lens is made up of two lens elements (104, 105), corresponding to the integrated circuit array is provided on a glass plate (103) mounted over the wafer (101). The lens array is aligned with the integrated circuit array such that each lens focuses an image on a single integrated circuit (102). The lens array is maintained in position by a plurality of spacer means (106). The glass sheet (103) and silicon wafer (101) thus provide an array of integrated circuits with associated lenses which may be separated into individual integrated circuits each with an associated lens by making a plurality of cuts along cutting channels (108) lying between the individual integrated circuits in the array. Once separated the integrated circuits and associated lenses may be packaged in a protective housing.</p> |
