发明名称 System and method for removing foreign particles from semiconductor device
摘要 A vibration device separates foreign particles from a semiconductor device, and a suction interface of a suction device covers an opening portion of the semiconductor device. A space connected with a vacuum passage and a communication passage is formed between the semiconductor device and the suction interface. The suction device suctions the space, and fresh air is introduced into the space through the communication passage. As a result, a current of air is generated from the communication passage to the vacuum passage, and foreign particles are suctioned and removed from the space.
申请公布号 US2007199580(A1) 申请公布日期 2007.08.30
申请号 US20070709296 申请日期 2007.02.22
申请人 DENSO CORPORATION 发明人 HASEBE YUTA;TANAKA HIROSHI;AZUKAWA MASANOBU;TANAKA JUNICHI;KOBAYASHI TADASHI;IWAHANA KENTA
分类号 A47L7/00;B08B7/02 主分类号 A47L7/00
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