发明名称 Power semiconductor device for suppressing substrate recirculation current and method of fabricating power semiconductor device
摘要 A power semiconductor device has a first region in which a transistor is formed, a third region in which a control element is formed, and a second region for separating the first region and the third region. The power semiconductor device includes a substrate of a first conductive type and a semiconductor region of a second conductive type arranged on the substrate, and a highly-doped buried layer of the second conductive type and a highly-doped bottom layer of the first conductive type are arranged between the substrate and the semiconductor region, and the first highly-doped bottom layer of the first conductive type is arranged on a top side and a bottom side of the highly-doped buried layer in the first region and extends by a predetermined distance to the second region, and a first isolation region is arranged on the highly-doped bottom layer extending from the first region in the second region, and a highly-doped region of the second conductive type is arranged on the highly-doped buried layer, and a second isolation region is arranged on a second highly-doped bottom layer of the first conductive type . By such structure, parasitic bipolar junction transistors in the first isolation region and the second isolation region can be electrically separated from the third region.
申请公布号 US2008318401(A1) 申请公布日期 2008.12.25
申请号 US20080229019 申请日期 2008.08.18
申请人 KWON TAE-HUN;KIM CHEOL-JOONG;JEONG YOUNG-SUB 发明人 KWON TAE-HUN;KIM CHEOL-JOONG;JEONG YOUNG-SUB
分类号 H01L21/425;H01L21/74;H01L21/761;H01L21/8234;H01L27/088;H01L29/10;H01L29/78;H01L29/788 主分类号 H01L21/425
代理机构 代理人
主权项
地址