| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that micro bumps are arranged uniformly in a region provided with pixels, and thereby the degree of freedom of design is very low.SOLUTION: The image sensor comprises: an imaging chip having a plurality of sets of a unit group which includes a plurality of pixels for converting incident light into a pixel signal, and an output line provided corresponding to the unit group and outputting pixel signals read from the plurality of pixels of a unit group, respectively; a signal processing chip having a plurality of A/D conversion sections for outputting pixel signals input from a plurality of output lines while digitizing and laminated on the imaging chip; and a plurality of connection bumps connecting the plurality of output lines and corresponding A/D conversion sections electrically, and arranged in the lamination plane of an imaging chip and a signal processing chip with non-uniform density. |
