| 摘要 |
Three-dimensional flexible electronic module consists of unpackaged electronic components, packaged electronic components and microboards with unpackaged active and passive electronic components. The module can contain different transducers and receiver-transmitter system. Unpackaged electronic components, packaged electronic components and microboards besides interconnections are electrically connected one to another by the means of flexible corrugated commutation boards having variable cross-section. Every heat emitting component is obtained by a heat sink, having a heat contact with external flexible cover of the module. Repairability of the module in the case of any component failure is provided. The being proposed construction, having all the advantages of three-dimensional modules (first of all, high packing density), is able to change its shape: be compressed and strained, bended in every direction without any change in functional properties. The invention has a broad area of applying, particularly for creating miniature robotics saving complexes in medical equipment. |
