NON-CONDUCTIVE THIN FILM DEPOSITION METHOD BY PULSED MAGNETRON SPUTTERING, THIN FILM USING THE SAME AND ELECTRONIC UNIT WITH IT

摘要

A non-conductive thin film deposition method using magnetron sputtering, a thin film deposited using the same and an electronic appliance having the same are provided to prevent electrical shock of an electronic appliance due to leakage of driving current or introduction of external current. A non-conductive thin film deposition method using magnetron sputtering comprises a step of preparing vacuum deposition equipment(1) having solid tin targets(21,23), magnetron sources(71,73) and a substrate(S). Argon gas of 5mTorr to 7mTorr is supplied to the vacuum deposition equipment and current of 0.3A or less is applied to the solid tin targets so that sputtering is performed to deposit a tin thin film on the substrate. The tin thin film is deposited for 10seconds or less.