| 发明名称 |
METHOD AND SYSTEM FOR PROCESSING SUBSTRATE IN SEMICONDUCTOR FABRICATION |
| 摘要 |
A method of processing a substrate in semiconductor fabrication is provided. The method includes supplying a mixture to a process module. The method further includes detecting the concentration of a substance in the mixture. The method also includes dispensing the mixture over a substrate in the process module. In addition, the method includes supplying a supply solution including the substance to the process module and dispensing the supply solution over the substrate if the concentration of the substance in the mixture is less than a desired value. |
| 申请公布号 |
US2016336200(A1) |
申请公布日期 |
2016.11.17 |
| 申请号 |
US201514725258 |
申请日期 |
2015.05.29 |
| 申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
JHUAN Chun-Syuan;CHEN Ming-Jung;KU Shao-Yen;SU Tsai-Pao |
| 分类号 |
H01L21/67;B08B3/04;H01L21/02 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of processing a substrate in semiconductor fabrication, comprising:
supplying a mixture from a storage module to a process module; detecting the concentration of a substance in the mixture; dispensing the mixture over the substrate disposed in the process module; supplying a supply solution including the substance to the process module and dispensing the supply solution over the substrate if the concentration of the substance in the mixture is less than a desired value. |
| 地址 |
Hsin-Chu TW |
