| 摘要 |
PROBLEM TO BE SOLVED: To suitably realize the creep-up of solder on the opposed long sides of a lead terminal without possibly narrowing the spacing of wirings in a mounting structure, comprising an electronic apparatus having a plurality of rectangular plate-like lead terminals, and a wiring board having wirings corresponding to the lead terminals soldered to the wirings, even if there is a positional deviation between the lead terminal and the wiring. SOLUTION: The ends of wirings 210 on a wiring board 200 locate at the opposed long sides of lead terminals 11. These ends have protrusions 211 protruding from the long sides of the lead terminals 11. The protrusions 211 are disposed at alternate positions between the adjacent wirings 210. COPYRIGHT: (C)2007,JPO&INPIT |
