发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a member for an electronic component which is composed of a ceramic sintered compact used as a substrate, a heat sink, or the like, and which is excellent in bonding properties with a metal. <P>SOLUTION: The member for the electronic component is composed of the ceramic sintered compact having a component mounting face or a circuit forming face, and the skewness of the component mounting face or the circuit forming face is 0 or less. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP4406396(B2) 申请公布日期 2010.01.27
申请号 JP20050367471 申请日期 2005.12.21
申请人 发明人
分类号 C04B35/00;C04B37/02 主分类号 C04B35/00
代理机构 代理人
主权项
地址