| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-reliability electronic device allowing a minute wiring and connection part to be correctly and easily provided without causing defect due to a connection state between a conductive region of a lower layer and the wiring/connection part which becomes a problem when forming the wiring/connection part by filling a void part formed on an interlayer insulation film with a conductive material. SOLUTION: A dummy structure 16 is formed, and sidewall films 17 are formed only on side surfaces of the dummy structure 16. An interlayer insulation film 18 is formed to cover the dummy structure 16. Only the dummy structure 16 is removed to leave the sidewall films 17, a part of lower-layer wiring 14 is exposed, an opening 18a formed on the interlayer insulation film 18 is embedded with Cu, and the surface layer of Cu is flattened in plane with the surface of the interlayer insulation film 18. Thus, a Cu connection part 22 directly connected to the lower-layer wiring 14 is formed. COPYRIGHT: (C)2010,JPO&INPIT |
