发明名称 |
DC-DC CONVERTER IMPLEMENTED IN A LAND GRID ARRAY PACKAGE |
摘要 |
A semiconductor chip package that includes a DC-DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC-DC power converter, including a synchronous buck PWM controller, driver circuits, and MOSFET devices. In particular, the LGA package comprises a substrate having a top surface and a bottom surface, with a DC-DC converter provided on the substrate. The DC-DC converter including at least one power silicon die disposed on the top surface of the substrate. A plurality of electrically and thermally conductive pads are provided on the bottom surface of the substrate in electrical communication with the DC-DC converter through respective conductive vias. The plurality of pads include first pads having a first surface area and second pads having a second surface area, the second surface area being substantially larger than the first surface area. Heat generated by the DC-DC converter is conducted out of the LGA package through the plurality of pads. |
申请公布号 |
EP1676316(A4) |
申请公布日期 |
2007.09.19 |
申请号 |
EP20040782293 |
申请日期 |
2004.08.26 |
申请人 |
POWER-ONE, INC. |
发明人 |
DIVAKAR, MYSORE PURUSHOTHAM;KEATING, DAVID;RUSSELL, ANTOIN |
分类号 |
H01L23/48;H01L23/36;H01L23/367;H01L23/52;H01L23/538;H01L25/16;H02M3/00;H02M3/10;H02M3/158 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|