HIGHLY-THERMALLY-CONDUCTIVE RESIN COMPOSITION, AND RESIN MATERIAL FOR HEAT DISSIPATION/HEAT TRANSFER AND THERMALLY CONDUCTIVE FILM COMPRISING SAME

摘要

The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

主权项

1. A resin composition comprising:
a resin having a main chain structure including: a unit (A) by 40 mol % to 60 mol %, the unit (A) having a biphenyl group and being represented by general formula (1): a unit (B) by 5 mol % to 40 mol %, the unit (B) being represented by general formula (2):
—CO—R1—CO—  (2) wherein R1 represents a bivalent linear substituent (a) whose number of atoms in its main chain length is 2 to 18 and (b) which is branched or not branched; and a unit (C) by 5 mol % to 40 mol %, the unit (C) being represented by general formula (3):
—CO—R2—CO—  (3) wherein R2 represents a bivalent linear substituent (a) whose number of atoms in its main chain length is 4 to 20 and is larger than the number of atoms in the main chain length of R1 and (b) which is branched or not branched, where a total amount of the units (A), (B), and (C) is 100 mol %, and a thermal conductivity of the resin itself is not less than 0.4 W/(m·K) and an inorganic filler having thermal conductivity of not less than 1 W/(m·K).