| 摘要 |
A heat sink according to the present invention is configured to comprise: a plurality of heat dissipating fins having at least bottom portions which form a heat receiving surface thermally connected to a heat generating electronic component; and a heat-transfer connecting member for, by passing through each of said plurality of heat dissipating fins arranged in parallel, connecting said plurality of heat dissipating fins in such a manner that said bottom portions form said heat receiving surface.
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