| 摘要 |
A sensor chip includes sensor pads, and the first set of differential detection signal pads are symmetrically arranged on both sides of a ground pad and are centered at the ground pad, the second set of differential detection signal pads are arranged on both sides thereof, and a power supply pad is arranged in one end of the two ends of the sensor pads. A processing circuit chip includes sensor connection pads including power supply connection pads, a ground connection pad, and two sets of differential detection signal connection pads, and the power supply connection pads connectable to the power supply pad of the sensor chip are arranged in two ends of the sensor connection pads. |
| 主权项 |
1. A sensor module having a differential type sensor chip, in which one or more sets of sensor elements to detect by using differential types are embedded, and a processing circuit chip that processes a differential detection signal from the sensor chip, wherein:
the sensor chip includes sensor pads arranged so as to face an outer circumference thereof, the sensor pads include a power supply pad, a ground pad, and at least a pair of differential detection signal pads, the pair of differential detection signal pads is arranged on both sides of one of the power supply pad and the ground pad, and the other of the power supply pad and the ground pad is arranged in at least one end of two ends of the sensor pads, so as to correspond to the power supply pad, the ground pad, and the pair of differential detection signal pads of the sensor chip, the processing circuit chip includes sensor connection pads including a power supply connection pad, a ground connection pad, and at least a pair of differential detection signal connection pads, and one or both of an arrangement in which the other of the power supply pad and the ground pad of the sensor chip is arranged in each of the two ends of the sensor pad and an arrangement in which the power supply connection pad or the ground connection pad, connectable to the other of the power supply pad and the ground pad of the sensor chip, is arranged in each of two ends of the sensor connection pad are adopted. |
