CONDUCTIVE ADHESIVE COMPOSITION

摘要

The present invention refers to a water base epoxy resin formulation which comprises the combination of a liquid epoxy resin of Bisphenol A diglycidylether and an aqueous dispersion of a liquid epoxy resin of Bisphenol A diglycidylether, a glycidyl ether resin and a latent curing agent, said formulation being suitable for the elaboration of a single-component conductive adhesive having conductive fillers evenly dispersed within the epoxy resin.