Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
申请公布号
EP3046148(A1)
申请公布日期
2016.07.20
申请号
EP20150170129
申请日期
2011.12.09
申请人
ANALOG DEVICES, INC.
发明人
O'DONNELL, ALAN;IRIARTE, SANTIAGO;MURPHY, MARK;LYDEN, COLIN G.;CASEY, GARY;ENGLISH, EOIN