| 摘要 |
The present invention relates to a thin film chip device and method for manufacturing the same. The thin film chip device according to one embodiment of the present invention includes a core layer; a metal pattern formed on the core layer; a coating layer coated on the metal pattern; and a compound layer which covers the metal pattern by using the coating layer as an insulating layer. According to one embodiment of the present invention, the coating layer includes nano silica particles. |
