发明名称 |
METHOD FOR FABRICATING A METAL RESISTOR IN AN IC CHIP AND RELATED STRUCTURE |
摘要 |
According to one exemplary embodiment, an integrated circuit chip comprises a first interconnect metal layer. The integrated circuit chip further comprises a first intermediate dielectric layer situated over the first interconnect metal layer (10). The integrated circuit chip further comprises a metal resistor (26) situated over the first intermetallic dielectric layer and below a second intermetallic dielectric layer. The integrated circuit chip further comprises a second interconnect metal layer over the second intermetallic dielectric layer. The integrated circuit chip further comprises a first intermediate via connected to first terminal of the metal resistor, where the first intermediate via is further connected to a first metal segment patterned in the second interconnect metal layer. The integrated circuit chip further comprises a second intermediate via connected to a second terminal of the metal resistor, where the second intermediate via is further connected to a second metal segment (14) patterned in the second interconnect metal layer. |
申请公布号 |
WO02075811(A3) |
申请公布日期 |
2002.11.14 |
申请号 |
WO2002US05861 |
申请日期 |
2002.02.22 |
申请人 |
CONEXANT SYSTEMS, INC. |
发明人 |
KAR ROY, ARJUN;HOWARD, DAVID;LIU, Q., Z. |
分类号 |
H01L21/02;H01L27/08 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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