Adhesion promoter for bonding a resin to a sheet of copper or copper alloy comprises a metal layer with a coralloidal structure formed by aggregation of copper or copper alloy particles

摘要

Adhesion promoter for bonding a resin to a sheet of copper or copper alloy comprises a metal layer with a coralloidal structure formed by aggregation of copper or copper alloy particles with voids between the particles resulting in micropores with an average diameter of 10-200 nm. There are an average of at least two micropores per mu m 2>of the metal layer. An independent claim is also included for producing a laminate by forming a metal layer as above and laminating a sheet of copper or copper alloy with a sheet of resin via the metal layer.