发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
According to the present invention, a printed circuit board comprises: a circuit layer and an insulating layer between the circuit layers. The insulating layer is made of a thermoplastic insulating material and a thermosetting insulating material. Therefore, the printed circuit board can secure component mounting properties and flexibility. |
申请公布号 |
KR20160097801(A) |
申请公布日期 |
2016.08.18 |
申请号 |
KR20150020109 |
申请日期 |
2015.02.10 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MOK, JEE SOO;KO, YOUNG GWAN;BAEK, YONG HO |
分类号 |
H05K1/18;H05K3/46 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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