发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 According to the present invention, a printed circuit board comprises: a circuit layer and an insulating layer between the circuit layers. The insulating layer is made of a thermoplastic insulating material and a thermosetting insulating material. Therefore, the printed circuit board can secure component mounting properties and flexibility.
申请公布号 KR20160097801(A) 申请公布日期 2016.08.18
申请号 KR20150020109 申请日期 2015.02.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 MOK, JEE SOO;KO, YOUNG GWAN;BAEK, YONG HO
分类号 H05K1/18;H05K3/46 主分类号 H05K1/18
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