HIGH-TEMPERATURE CERAMIC SOCKET CONFIGURED TO TEST PACKAGED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a test socket assembly that endures high temperature and is less likely to have short-circuiting caused by peeling of a socket material.SOLUTION: A single piece socket 46 is formed substantially of an insulating material and has a plurality of holes 32 formed therein configured to receive a plurality of electrically conductive springs 36. Each hole 32 of the single-piece socket 46 accommodates therein a separate one of the electrically conductive springs 36. The test socket 46 includes a plurality of pins 10 configured to receive leads 48 of an integrated circuit 50, the pins 10 of the test socket 46 extending into the plurality of holes 32 of the single-piece socket 46 and being in contact with a spring 36. The single piece socket 46 is positioned on a circuit board 40 such that the plurality of holes 32 are aligned with electrical contacts 34 on the circuit board 40 in order to make the plurality of springs 36 electrically interconnect the electrical contacts 34 and the plurality of pins 10. The single-piece socket 46 is formed substantially of a high-temperature insulating material, such as ceramic.SELECTED DRAWING: Figure 3