发明名称 ELECTRICAL MODULES AND MODULAR ELECTRONIC BUILDING SYSTEMS
摘要 The present disclosure provides an electrical module and a modular electrical building system including electrical modules. The electrical module includes a printed circuit board (PCB), a housing member, one or more magnets, and one or more inter-locking parts. The PCB has a top surface, a bottom surface, and opposite sides between the top surface and the bottom surface. The housing member is attached to each side of two opposite sides of the PCB and includes an opening in a bottom surface. The magnets are arranged within the housing member and are capably of magnetically attaching the electrical module to another electrical module. Each inter-locking part is configured to pass through the housing member on each side of the PCB. Each inter-locking part has a protrusion extending from a top surface of the housing member and is exposed to the opening in the bottom surface of the housing member.
申请公布号 US2016249478(A1) 申请公布日期 2016.08.25
申请号 US201514721341 申请日期 2015.05.26
申请人 Microduino Inc. ;Microduino Technologies (Beijing) Ltd. Inc. 发明人 WANG ZHENSHAN;PAN KEJIA;FENG BIN
分类号 H05K7/14 主分类号 H05K7/14
代理机构 代理人
主权项 1. An electrical module, comprising: a printed circuit board (PCB) having a top surface, a bottom surface, and opposite sides between the top surface and the bottom surface; a housing member attached to each side of two opposite sides of the PCB, wherein the housing member includes an opening in a bottom surface of the housing member; one or more magnets arranged within the housing member and capably of magnetically attaching the electrical module to another electrical module; and one or more inter-locking parts configured to pass through the housing member on each side of the PCB, wherein each inter-locking part has a protrusion extending from a top surface of the housing member and is exposed to the opening in the bottom surface of the housing member.
地址 Oak Park CA US